Staff SLT Test Engineer
Graphcore
· Austin, Texas, United States
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Responsibilities
- Lead development and deployment of SLT hardware and software solutions supporting silicon bring-up, characterization, yield learning, and manufacturing deployment
- Own major SLT workstreams and drive execution from requirements definition through deployment and production readiness
- Develop and integrate SLT test content in collaboration with Silicon Validation, Bring-up, Product Engineering, and Manufacturing teams
- Lead development of SLT hardware including test boards, sockets, thermal solutions, instrumentation, and vendor engagements
- Develop and maintain SLT software frameworks, automation infrastructure, diagnostics, telemetry collection, and data analysis tools
- Drive characterization activities including voltage margining, frequency characterization, thermal characterization, and reliability screening
- Lead debug, failure analysis, root-cause investigations, and correlation activities across Simulation, ATE, Bench, SLT, and manufacturing environments
- Define and optimize test coverage, test time, screening effectiveness, DPPM, and manufacturing test strategies
- Support transfer of SLT solutions into OSAT and contract manufacturing environments and provide production ramp support
- Work closely with DFT teams to understand testability, observability, scan architectures, and manufacturing test requirements
- Contribute to definition of future SLT architectures, methodologies, and infrastructure requirements
- Mentor junior engineers and provide technical leadership within the team
- Drive technical reviews, project planning, risk management, and execution tracking for assigned workstreams
- Collaborate with external vendors and industry partners to evaluate and deploy SLT platforms and solutions
Requirements
- Experience in System-Level Test, production test, characterization, or post-silicon validation of complex semiconductor products
- Strong understanding of semiconductor fundamentals, power delivery, signal integrity, board design practices, and advanced packaging technologies
- Knowledge of DFT methodologies including scan, JTAG, BIST, MBIST, boundary scan, and manufacturing test architectures
- Experience working with OSATs, contract manufacturers, and high-volume manufacturing environments
- Strong scripting, automation, and debug skills using Python, Tcl, Shell, Perl, or similar languages
- Demonstrated ability to lead technical projects and coordinate cross-functional activities
- Strong communication, collaboration, and problem-solving skills
- Bachelor's degree in electrical engineering, Computer Engineering, or related field
Skills
- System-Level Test (SLT)
- Semiconductor test and validation
- Python
- Tcl
- Shell
- Perl
- DFT methodologies
- JTAG
- BIST
- MBIST
- Board design
- Power delivery
- Signal integrity
- Advanced packaging
- OSAT engagement
- Production test
- Characterization
- Post-silicon validation
- Failure analysis
- Automation infrastructure
- Diagnostics
- Telemetry collection
- Data analysis
- Test coverage optimization
- DPPM
- Manufacturing test strategies
- Vendor management
- Technical leadership
- Project planning
- Risk management
- Cross-functional collaboration
- Silicon bring-up
- Yield learning
- Thermal solutions
- Instrumentation
- Voltage margining
- Frequency characterization
- Thermal characterization
- Reliability screening
- Root-cause investigations
- Scan architectures
- Manufacturing test requirements
- SLT architectures
- Methodologies
- Infrastructure requirements
- Mentoring
- Technical reviews
- Execution tracking
- 2.5D/3D stacked semiconductor products
- Chiplets
- CoWoS
- SoIC
- HCB
- Manufacturing test flows
- Production ramp activities
- Electrical engineering
- Computer engineering
- Communication
- Problem-solving
- Collaboration
- Flexible working
- Health and wellbeing
- Financial future
- Medical coverage
- Dental coverage
- Vision coverage
- Flexible Spending Accounts
- Health Savings Accounts
- Disability insurance
- Life insurance
- 401(k) retirement plan
- Commuter benefits
- Wellness services
- Employee Assistance Programme
- Equal opportunity
- Inclusive work environment
- Reasonable adjustments
- Interview flexibility
- Competitive salary
- Comprehensive benefits package
- SoftBank Group
- AI compute
- Semiconductor
- Software
- AI experts
- Datacenter scale
- AI ecosystem
- Product Test and Diagnosis Department
- PTD
- Hardware defects
- Chips
- Boards
- Finished systems
- Manufacturing sites
- Field
- Test boards
- Sockets
- Thermal solutions
- Instrumentation
- Vendor engagements
- SLT software frameworks
- Automation infrastructure
- Diagnostics
- Telemetry collection
- Data analysis tools
- Voltage margining
- Frequency characterization
- Thermal characterization
- Reliability screening
- Debug
- Failure analysis
- Root-cause investigations
- Correlation activities
- Simulation
- ATE
- Bench
- SLT
- Manufacturing environments
- Test coverage
- Test time
- Screening effectiveness
- DPPM
- Manufacturing test strategies
- OSAT
- Contract manufacturing
- Production ramp support
- DFT teams
- Testability
- Observability
- Scan architectures
- Manufacturing test requirements
- Future SLT architectures
- Methodologies
- Infrastructure requirements
- Mentor junior engineers
- Technical leadership
- Technical reviews
- Project planning
- Risk management
- Execution tracking
- Assigned workstreams
- External vendors
- Industry partners
- SLT platforms
- SLT solutions
- System-Level Test Engineer
- Product Test and Diagnostics team
- Silicon Validation
- Bring-up
- Product Engineering
- Manufacturing teams
- SLT hardware
- SLT software
- Automation
- Characterization solutions
- Silicon bring-up
- Yield learning
- Manufacturing readiness
- Production deployment
- Semiconductor test
- Validation
- Product quality
- Manufacturability
- Hardware defects
- Manufacture
- Use of products
- Chips
- Boards
- Finished systems
- Manufacturing sites
- Field
- SLT hardware solutions
- SLT software solutions
- Silicon bring-up
- Characterization
- Yield learning
- Manufacturing deployment
- SLT workstreams
- Requirements definition
- Deployment
- Production readiness
- SLT test content
- Silicon Validation
- Bring-up
- Product Engineering
- Manufacturing teams
- SLT hardware
- Test boards
- Sockets
- Thermal solutions
- Instrumentation
- Vendor engagements
- SLT software frameworks
- Automation infrastructure
- Diagnostics
- Telemetry collection
- Data analysis tools
- Characterization activities
- Voltage margining
- Frequency characterization
- Thermal characterization
- Reliability screening
- Debug
- Failure analysis
- Root-cause investigations
- Correlation activities
- Simulation
- ATE
- Bench
- SLT
- Manufacturing environments
- Test coverage
- Test time
- Screening effectiveness
- DPPM
- Manufacturing test strategies
- SLT solutions
- OSAT
- Contract manufacturing
- Production ramp support
- DFT teams
- Testability
- Observability
- Scan architectures
- Manufacturing test requirements
- Future SLT architectures
- Methodologies
- Infrastructure requirements
- Junior engineers
- Technical leadership
- Technical reviews
- Project planning
- Risk management
- Execution tracking
- Assigned workstreams
- External vendors
- Industry partners
- SLT platforms
- SLT solutions
- System-Level Test
- Production test
- Characterization
- Post-silicon validation
- Complex semiconductor products
- Semiconductor fundamentals
- Power delivery
- Signal integrity
- Board design practices
- Advanced packaging technologies
- DFT methodologies
- Scan
- JTAG
- BIST
- MBIST
- Boundary scan
- Manufacturing test architectures
- OSATs
- Contract manufacturers
- High-volume manufacturing environments
- Scripting
- Automation
- Debug skills
- Python
- Tcl
- Shell
- Perl
- Technical projects
- Cross-functional activities
- Communication
- Collaboration
- Problem-solving skills
- Electrical engineering
- Computer Engineering
- Related field
- 2.5D/3D stacked semiconductor products
- Advanced packaging technologies
- Chiplets
- CoWoS
- SoIC
- HCB
- Integration methods
- Manufacturing test flows
- OSAT engagement
- Production ramp activities
- Competitive salary
- Flexible working
- Comprehensive benefits package
- Health
- Wellbeing
- Financial future
- Medical
- Dental
- Vision coverage
- Flexible Spending Accounts
- FSAs
- Health Savings Accounts
- HSAs
- Disability
- Life insurance
- 401(k) retirement plan
- Commuter benefits
- Wellness services
- Employee Assistance Programme
- EAP
- Different backgrounds
- Experiences
- Inclusive work environment
- Equal opportunity process
- Visible and invisible differences
- Flexible approach to interview
- Reasonable adjustments
- Graphcore
- AI compute
- Semiconductor
- Software
- AI experts
- Complete AI compute stack
- Silicon
- Software
- Infrastructure
- Datacenter scale
- SoftBank Group
- Long-term investment
- SoftBank AI ecosystem
- AI opportunity
- Teams around the world
- Brightest minds
- Toughest problems
- Impact on company
- Products
- Future of artificial intelligence
- System Level Test Engineer
- Product Test and Diagnosis Department
- PTD
- System Level Test
- SLT
- Next-generation AI processors
- Cross-functional teams
- SLT hardware
- Software
- Automation
- Characterization solutions
- Silicon bring-up
- Yield learning
- Manufacturing readiness
- Production deployment
- Technical depth
- Semiconductor test
- Validation
- Passion
- Complex engineering challenges
- Product quality
- Manufacturability
- Product Test and Diagnostics team
- Hardware defects
- Manufacture
- Use of products
- Chips
- Boards
- Finished systems
- Manufacturing sites
- Field
- SLT hardware
- Software solutions
- Silicon bring-up
- Characterization
- Yield learning
- Manufacturing deployment
- SLT workstreams
- Requirements definition
- Deployment
- Production readiness
- SLT test content
- Silicon Validation
- Bring-up
- Product Engineering
- Manufacturing teams
- SLT hardware
- Test boards
- Sockets
- Thermal solutions
- Instrumentation
- Vendor engagements
- SLT software frameworks
- Automation infrastructure
- Diagnostics
- Telemetry collection
- Data analysis tools
- Characterization activities
- Voltage margining
- Frequency characterization
- Thermal characterization
- Reliability screening
- Debug
- Failure analysis
- Root-cause investigations
- Correlation activities
- Simulation
- ATE
- Bench
- SLT
- Manufacturing environments
- Test coverage
- Test time
- Screening effectiveness
- DPPM
- Manufacturing test strategies
- SLT solutions
- OSAT
- Contract manufacturing
- Production ramp support
- DFT teams
- Testability
- Observability
- Scan architectures
- Manufacturing test requirements
- Future SLT architectures
- Methodologies
- Infrastructure requirements
- Junior engineers
- Technical leadership
- Technical reviews
- Project planning
- Risk management
- Execution tracking
- Assigned workstreams
- External vendors
- Industry partners
- SLT platforms
- SLT solutions
- System-Level Test
- Production test
- Characterization
- Post-silicon validation
- Complex semiconductor products
- Semiconductor fundamentals
- Power delivery
- Signal integrity
- Board design practices
- Advanced packaging technologies
- DFT methodologies
- Scan
- JTAG
- BIST
- MBIST
- Boundary scan
- Manufacturing test architectures
- OSATs
- Contract manufacturers
- High-volume manufacturing environments
- Scripting
- Automation
- Debug skills
- Python
- Tcl
- Shell
- Perl
- Technical projects
- Cross-functional activities
- Communication
- Collaboration
- Problem-solving skills
- Electrical engineering
- Computer Engineering
- Related field
- 2.5D/3D stacked semiconductor products
- Advanced packaging technologies
- Chiplets
- CoWoS
- SoIC
- HCB
- Integration methods
- Manufacturing test flows
- OSAT engagement
- Production ramp activities
- Competitive salary
- Flexible working
- Comprehensive benefits package
- Health
- Wellbeing
- Financial future
- Medical
- Dental
- Vision coverage
- Flexible Spending Accounts
- FSAs
- Health Savings Accounts
- HSAs
- Disability
- Life insurance
- 401(k) retirement plan
- Commuter benefits
- Wellness services
- Employee Assistance Programme
- EAP
- Different backgrounds
- Experiences
- Inclusive work environment
- Equal opportunity process
- Visible and invisible differences
- Flexible approach to interview
- Reasonable adjustments
Benefits
- Medical, dental and vision coverage
- Flexible Spending Accounts (FSAs)
- Health Savings Accounts (HSAs)
- Disability and life insurance
- 401(k) retirement plan
- Commuter benefits
- Wellness services
- Employee Assistance Programme (EAP)
- Flexible working
About GraphcoreAt Graphcore, we’re building the future of AI compute.We’re a team of semiconductor, software and AI experts, with deep experience in creating the complete AI compute stack - from silicon and software to infrastructure at datacenter scale.As part of the SoftBank Group, backed by significant long-term investment, we are delivering key technology into the fast-growing SoftBank AI ecosystem.To meet the vast and exciting AI opportunity, Graphcore is expanding its teams around the world.We are bringing together the brightest minds to solve the toughest problems, in a place where everyone has the opportunity to make an impact on the company, our products and the future of artificial intelligence. Job Summary We are looking for an experienced System Level Test Engineer to join our Product Test and Diagnosis Department (PTD). In this role, you will lead the development and deployment of System Level Test (SLT) solutions for next-generation AI processors. Working closely with cross-functional teams, you will contribute to the design and implementation of SLT hardware, software, automation, and characterization solutions that support silicon bring-up, yield learning, manufacturing readiness, and production deployment. The ideal candidate will possess strong technical depth in semiconductor test and validation, a passion for solving complex engineering challenges, and a strong focus on product quality and manufacturability. The Team The Product Test and Diagnostics team’s role is to detect and manage hardware defects that arise from the manufacture and use of our products. This covers chips, boards and finished systems and takes place both in the manufacturing sites and in the field. Responsibilities and Duties Lead development and deployment of SLT hardware and software solutions supporting silicon bring-up, characterization, yield learning, and manufacturing deployment. Own major SLT workstreams and drive execution from requirements definition through deployment and production readiness. Develop and integrate SLT test content in collaboration with Silicon Validation, Bring-up, Product Engineering, and Manufacturing teams. Lead development of SLT hardware including test boards, sockets, thermal solutions, instrumentation, and vendor engagements. Develop and maintain SLT software frameworks, automation infrastructure, diagnostics, telemetry collection, and data analysis tools. Drive characterization activities including voltage margining, frequency characterization, thermal characterization, and reliability screening. Lead debug, failure analysis, root-cause investigations, and correlation activities across Simulation, ATE, Bench, SLT, and manufacturing environments. Define and optimize test coverage, test time, screening effectiveness, DPPM, and manufacturing test strategies. Support transfer of SLT solutions into OSAT and contract manufacturing environments and provide production ramp support. Work closely with DFT teams to understand testability, observability, scan architectures, and manufacturing test requirements. Contribute to definition of future SLT architectures, methodologies, and infrastructure requirements. Mentor junior engineers and provide technical leadership within the team. Drive technical reviews, project planning, risk management, and execution tracking for assigned workstreams. Collaborate with external vendors and industry partners to evaluate and deploy SLT platforms and solutions. Candidate Profile Essential: Experience in System-Level Test, production test, characterization, or post-silicon validation of complex semiconductor products. Strong understanding of semiconductor fundamentals, power delivery, signal integrity, board design practices, and advanced packaging technologies. Knowledge of DFT methodologies including scan, JTAG, BIST, MBIST, boundary scan, and manufacturing test architectures. Experience working with OSATs, contract manufacturers, and high-volume manufacturing environments. Strong scripting, automation, and debug skills using Python, Tcl, Shell, Perl, or similar languages. Demonstrated ability to lead technical projects and coordinate cross-functional activities. Strong communication, collaboration, and problem-solving skills. Bachelor's degree in electrical engineering, Computer Engineering, or related field. Desirable Experience with System-Level Test (SLT), production test, characterization, or post-silicon validation of 2.5D/3D stacked semiconductor products. Familiarity with advanced packaging technologies such as chiplets, CoWoS, SoIC, HCB, or other integration methods. Experience with manufacturing test flows, OSAT engagement, and production ramp activities. . BenefitsIn addition to a competitive salary, Graphcore offers flexible working and a comprehensive benefits package designed to support your health, wellbeing and financial future. Our benefits include medical, dental and vision coverage, Flexible Spending Accounts (FSAs), Health Savings Accounts (HSAs), disability and life insurance, a 401(k) retirement plan, commuter benefits, wellness services and an Employee Assistance Programme (EAP). We welcome people of different backgrounds and experiences; we're committed to building an inclusive work environment that makes Graphcore a great home for everyone. We offer an equal opportunity process and understand that there are visible and invisible differences in all of us. We can provide a flexible approach to interview and encourage you to chat to us if you require any reasonable adjustments.
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